MediaTek Unveils Dimensity 9600 Pro Chip Using TSMC 2nm Process

MediaTek has unveiled its next-generation flagship smartphone chip, the Dimensity 9600 Pro, using TSMC's 2nm process technology. The chip features over 3.3 billion transistors. Marsbit reported that MediaTek showcased the product at its '2026 Dimensity Flagship New Product Launch Event' held on May 15.

The chipset adopts a heterogeneous computing architecture combining CPU, GPU, NPU, and ISP cores. According to Marsbit, the Dimensity 9600 Pro features two 4.55GHz C2-Ultra cores, three 4.35GHz C2-Pro cores, and three 3.1GHz C2-Pro cores, supporting LPDDR6 memory and UFS 5.0 storage. MediaTek stated that compared to its predecessor, the Dimensity 9500, the new chip reduces power consumption by 37% for large cores and 61% for multi-core operations.

Marsbit reported benchmark scores of 4,276 in single-core and 12,650 in multi-core on Geekbench V6.4. MediaTek also announced a 51% improvement in NPU performance over the previous model.